Optomec’s 3D printed electronics solution boosts 5G signals by up to 100%

ALBUQUERQUE, New Mexico – (COMMERCIAL THREAD) – Optomec has introduced a new high performance semiconductor packaging solution for the rapidly growing millimeter wave electronics market, in response to customer demands in the 5G, autonomous vehicle, defense and medical segments. The use of millimeter wave integrated circuits (ICs) is increasing at a CAGR of 27%, but has been hampered in many applications because the traditional techniques used to connect integrated circuits to circuits lead to poor circuit performance in the form of ” low wireless range and / or high power consumption. Optomec’s 3D printed interconnect solution solves this gap by preserving device performance with low loss connections.

Optomec customers have reported an increase of up to 100% in transmitted signal strength for each circuit connection within the millimeter range. This results in a longer point-to-point range for wireless data transmission, reduced power consumption and, because low-power integrated circuits can operate at lower temperatures, longer integrated circuit life. . The millimeter wave frequency band includes 30 to 300 GHz. While today’s typical home or office wireless network operates at 5 GHz, next-generation millimeter wave wireless networks will operate at frequencies up to 53 GHz; automotive radars, defense applications and medical imaging sensors operate at even higher frequencies. Older methods of connecting integrated circuits, such as using tiny gold wires, are less and less efficient as the frequency increases, but the Aerosol Jet® method of impression connection to integrated circuits is much more efficient, with performance almost matching the traces of copper etched on printed circuit boards.

“Our customers report very impressive performance improvements for mm-Wave interconnects. Said Bryan Germann, Optomec Product Manager. “Customers in many industries using millimeter wave frequency bands are seeing the benefits of printing interconnects instead of standard wire or tape bindings. The benefit of shorter, better impedance-matched transitions reduces losses for each die-to-die or die-to-board. This leads to improvements in overall device efficiency and performance. ”

The aerosol spray® The process works by projecting extremely fine droplets of conductive nanoparticle inks onto printed circuit boards and components from a distance of up to 10mm, but it can produce conductive features as fine as 10 microns in width. The new aerosol spray from Optomec® The HD2 printer with ultra-high print resolution and integrated vision-based alignment has been optimized to support this new IC solution for full production applications. The HD2 supports standardized in-line automation for direct integration into existing packaging lines. Optomec further offers its customers prequalified print recipes and application libraries for a complete production ready solution.

Optomec is a rapidly growing private supplier of additive manufacturing systems. Optomec’s patented aerosol spray systems for printed electronics and LENS and Huffman branded 3D printers for the production and repair of metal components are used by industry to reduce product cost and improve performance . Together, these unique printing solutions work with the widest range of functional materials, from electronic inks to structural metals and even biological material. Optomec has delivered more than 500 of its proprietary additive manufacturing systems to more than 200 renowned customers around the world, for production applications in the electronics, energy, life sciences and engineering industries. aerospace. Our users include countless top-notch manufacturing companies, such as GE, Samsung, Raytheon, Siemens, Lockheed, and LiteOn, as well as the US Air Force, US Navy, US Army, and NASA. For more information, visit optomec.com.

LENS is a registered trademark of Sandia National Labs; Aerosol Jet is a registered trademark of Optomec, Inc.


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